Surface roughness generated by plasma etching processes of silicon
M Martin, G Cunge - Journal of Vacuum Science & Technology B …, 2008 - pubs.aip.org
The authors used atomic force microscopy to analyze the roughness generated on c-Si
(100) surfaces when etched in high-density plasmas over a wide range of conditions …
(100) surfaces when etched in high-density plasmas over a wide range of conditions …
A semi-fixed abrasive machining technique
J Yuan, Z Wang, T Hong, Q Deng… - … of Micromechanics and …, 2009 - iopscience.iop.org
This paper proposes the technique of semi-fixed abrasive machining to reduce or eliminate
the surface defects caused by large abrasive grains and improve the efficiency of ultra …
the surface defects caused by large abrasive grains and improve the efficiency of ultra …
Thin-dielectric-layer engineering for 3D nanostructure integration using an innovative planarization approach
Y Guerfi, JB Doucet, G Larrieu - Nanotechnology, 2015 - iopscience.iop.org
Abstract Three-dimensional (3D) nanostructures are emerging as promising building blocks
for a large spectrum of applications. One critical issue in integration regards mastering the …
for a large spectrum of applications. One critical issue in integration regards mastering the …
Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in …
A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror
application is demonstrated by wafer bonding technology in CMOS-compatible processes in …
application is demonstrated by wafer bonding technology in CMOS-compatible processes in …
A novel prototyping method for die-level monolithic integration of MEMS above-IC
This work presents a convenient and versatile prototyping method for integrating surface-
micromachined microelectromechanical systems (MEMS) directly above IC electronics, at …
micromachined microelectromechanical systems (MEMS) directly above IC electronics, at …
Miniaturization of free space optical systems
O Solgaard - Applied optics, 2010 - opg.optica.org
Coherent illumination enables not only integrated optics, but also miniaturized free-space
optics that takes advantage of the amplitude and phase control afforded by optical …
optics that takes advantage of the amplitude and phase control afforded by optical …
Damascene chemical-mechanical polishing characterization and modeling for polysilicon microelectromechanical systems structures
BD Tang, X Xie, DS Boning - Journal of The Electrochemical …, 2005 - iopscience.iop.org
We apply a chip-scale chemical-mechanical polishing (CMP) modeling methodology to
microelectromechanical systems (MEMS) fabrication. This methodology uses direct …
microelectromechanical systems (MEMS) fabrication. This methodology uses direct …
Multi-scale scratching in chemical-mechanical polishing
T Eusner - 2010 - dspace.mit.edu
In the fabrication of ultra-large-scale integrated (ULSI) semiconductor devices, the chemical-
mechanical polishing (CMP) process is extensively employed. During the CMP process …
mechanical polishing (CMP) process is extensively employed. During the CMP process …
Fabrication of microdevices using CMP
G Zwicker - Microelectronic Applications of Chemical Mechanical …, 2007 - books.google.com
This chapter describes further applications of chemical–mechanical polishing (CMP) beyond
those used in classical microelectronic production. Since its success as an enabling …
those used in classical microelectronic production. Since its success as an enabling …
[图书][B] Optimierung von Flüssigkristall-Lichtmodulatoren in aktiven optischen Systemen
C Kohler - 2009 - elib.uni-stuttgart.de
Die Dissertation behandelt den Einsatz von reflektiven Flüssigkristallmodulatoren,
sogenanntenLiquid Crystal on Silicon Displays (LCoS), in aktiven optischen Systemen. Es …
sogenanntenLiquid Crystal on Silicon Displays (LCoS), in aktiven optischen Systemen. Es …