This paper reviews sintered silver (s-Ag) die-attach materials for wide band gap (WBG)
semiconductor packaging. WBG devices that die-attach with s-Ag have attracted a lot of …

This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for
silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of …

The presented analysis has been aimed to evaluate the impact of die solder and sintering
solution for automotive power modules in terms of thermal behavior. First, dedicated …

The massive development of Hybrid and Electrical Vehicles (HEV) is strongly impacting the
semiconductor industry demanding for highly reliable Power Electronic components. Within …

This work presents an integrated experimental–numerical method to characterize, model,
and experimentally study the properties of transfer molded power modules, considering two …

In this paper an overview on Power Packages challenges and technology approaches is
given. These challenges mainly originate from Silicon Carbide MOSFETs superior …

This work has investigated the impact of crystallographic structure on SnAgCu (SAC) solder
reliability at print board circuit (PCB) level. A detailed reliability analysis has been performed …

In the present work it is shown how stress engineering can be used in semiconductor
industry to improve Power MOSFET transistor's performance beyond simple geometrical …

New technological and packaging solutions are more and more being employed for power
semiconductor switches in an automotive environment, especially the SiC-and GaN-based …

This study developed a 3D Computational Fluid Dynamics (CFD) model to compute the
thermal resistance of the SiC-based direct cooled ACEPACK™ DRIVE power module, by …