The fluorination of the polymer polyethylene terephthalate in plasma created from SF6 or
CF4 gas at various pressures was investigated. The surface was analysed by X-ray …

Low capacitance is critical to the electric performance of through-silicon-vias (TSVs). This
paper reports the development of a low capacitance TSVs by replacing silicon dioxide …

Low capacitance is critical to the electric performance of through-silicon vias (TSVs). This
paper reports the development and electrical characterization of ultralow-capacitance TSVs …

Through-Silicon-Vias (TSVs) with polymer liners have potential improved electrical and
mechanical reliability for three-dimensional (3D) packaging/integration applications. To …

Through-silicon-vias (TSVs) using benzocyclobutene (BCB) as insulation layers (liners) are
developed and the reliability related issues with regard to mechanical and electrical aspects …

We present a low-temperature processing scheme for the integration of either lateral or
vertical nanowire (NW) transistors with a multilayer back-end-of-line interconnect stack. The …

Highly anisotropic features of benzocyclobutene, a promising low stress layer for
microelectromechanical systems, were achieved by inductively coupled plasma (ICP) …

This paper reports reactive ion etching (RIE) of poly (cyclohexene carbonate)(PCC), a
thermal decomposable polymer that can be used as a sacrificial material for fabrication of …

Etching of thick nonphotosensitive benzocyclobutene (BCB) was investigated using a high
density SF 6/O 2 plasma with an inductively coupled plasma (ICP) etcher. The effects of SF 6 …

In this article we report on the reduction of redeposition during inductively coupled plasma
(ICP) etching of benzocyclobutene (BCB) with a soft mask in a sulfur hexafluoride/oxygen …