The bonding between glass and metal
R Yi, C Chen, Y Li, H Peng, H Zhang, X Ren - The International Journal of …, 2020 - Springer
Glass and metal have wide applications in various industries due to their excellent
properties. To make the most use of their properties and enlarge their applications, it is …
properties. To make the most use of their properties and enlarge their applications, it is …
Microstructure and formation mechanism of Al2O3/Zn5Al/2024Al joint by ultrasonic assisted soldering process
H Li, Y Li, C Chen - Journal of Manufacturing Processes, 2022 - Elsevier
Zn5Al filler metal was used to join 2024Al and Al 2 O 3 ceramic with the ultrasonic assisted
soldering process in the atmospheric environment. Al 2 O 3 ceramics were dipped by molten …
soldering process in the atmospheric environment. Al 2 O 3 ceramics were dipped by molten …
Joining of Al2O3 ceramic to Cu using refractory metal foil
B Jin, X Huang, M Zou, Y Zhao, S Wang, Y Mao - Ceramics International, 2022 - Elsevier
Joining of Al 2 O 3 ceramic to Cu has been conducted with Ag-26.7 Cu-4.5 Ti braze and
refractory metal (W or Ta) foil. The interfacial microstructure in the joint with W foil is similar to …
refractory metal (W or Ta) foil. The interfacial microstructure in the joint with W foil is similar to …
Microstructural stability and mechanical properties of Al2O3/Kovar 4 J34 joint vacuum brazed using Ag-5Cu-1Al-1.25 Ti (wt%) filler metal
JL Wang, ZW Yang, Y Wang, DP Wang, HJ Li - Journal of Manufacturing …, 2021 - Elsevier
The Al 2 O 3 ceramic and Kovar 4 J34 alloy were effectively bonded by vacuum brazing by
using an Ag-based filler metal with a composition of Ag-5Cu-1Al-1.25 Ti (wt%). The typical …
using an Ag-based filler metal with a composition of Ag-5Cu-1Al-1.25 Ti (wt%). The typical …
Effect of AlN addition on phase formation in the LTCC with Al2O3/AlN biphasic ceramics based on BBSZ glass
X Feng, Y Lv, L Zhang, D Ge, X Li, J Sun, J Ding… - Ceramics …, 2020 - Elsevier
The miniaturization, integration and portability of electronic products place higher
requirements on the thermal conductivity of electronic packaging materials. In this paper, Bi …
requirements on the thermal conductivity of electronic packaging materials. In this paper, Bi …
Effect of GNPs content at various compaction pressures and sintering temperatures on the mechanical and electrical properties of hybrid Cu/Al2O3/xGNPs …
M Abu–Okail, WM Shewakh, AM Brisha… - Ceramics …, 2020 - Elsevier
Hybrid nanocomposites can be synthesized by high energy ball milling to form different
compositions of Copper (Cu) strengthened with 10% alumina (Al 2 O 3) and x graphene …
compositions of Copper (Cu) strengthened with 10% alumina (Al 2 O 3) and x graphene …
Microstructural characterizations of metallized Al2O3 before/after surface treatment and Al2O3/Cu soldered joint
H Hu, L Huang, B Xu, J Haider, FN Khan… - Materials Characterization, 2024 - Elsevier
Joining Al 2 O 3 ceramics to Cu heat pipes should be conducted at low temperatures since
Cu heat pipes may fail at temperatures higher than 320° C. Due to the poor wettability of low …
Cu heat pipes may fail at temperatures higher than 320° C. Due to the poor wettability of low …
Fabrication and joining mechanism of Nano-Cu/Si3N4 ceramic substrates
C Xin, R Yuan, J Wu, Q Wang, Y Zhou - Ceramics International, 2021 - Elsevier
A novel method for fabricating a nano-Cu/Si 3 N 4 ceramic substrate is proposed. The nano-
Cu/Si 3 N 4 ceramic substrate is first fabricated using spark plasma sintering (SPS) with the …
Cu/Si 3 N 4 ceramic substrate is first fabricated using spark plasma sintering (SPS) with the …
Interfacial reaction and thermoelectric properties of Sr0. 9La0. 1TiO3 ceramic diffusion bonding joints with different electrode layers
P Wang, Z Lou, S Zhao, H Chen, F Gao, W Li - Vacuum, 2023 - Elsevier
Abstract n-Sr 0.9 La 0.1 TiO 3 ceramic and Al 2 O 3 substrate were welded by vacuum
diffusion bonding with different electrode layers. Some intermetallic compounds could be …
diffusion bonding with different electrode layers. Some intermetallic compounds could be …
Interfacial microstructure evolution and mechanical characterization of brazed Al2O3 joints with Ni‒Ti interlayer: An experimental and theoretical approach
Q Zhang, K Zheng, J Wang, X Qin - Intermetallics, 2024 - Elsevier
Reliable brazing joints of Al 2 O 3 ceramics were obtained using an active Ni‒Ti interlayer
under vacuum conditions. The interfacial microstructure and mechanical properties of the …
under vacuum conditions. The interfacial microstructure and mechanical properties of the …