The growing demand for electronic devices, smart devices, and the Internet of Things
constitutes the primary driving force for marching down the path of decreased critical …

In integrated circuit (IC) manufacturing, fast, nondestructive, and precise detection of defects
in patterned wafers, realized by bright-field microscopy, is one of the critical factors for …

With the ever-increasing demand for sub-10 nm integrated circuit chips in the fields such as
consumer electronics, interconnect hardware, and electronic medical equipment, the impact …

On-chip integration of micro-optoelectronic devices through advanced fabrication processes
imposes an urgent need for optical means of visualizing hidden structural defects …

Optical far-field detection and imaging of deep-subwavelength objects in a large-area wafer
is challenging because of the well-known diffraction barrier and weak Rayleigh scattering …

This is the report of a hybrid working group meeting held on April 25, 2023, at the National
Institute of Standards and Technology (NIST) in Boulder, CO. The working group was …

Through-focus scanning optical microscopy (TSOM) is a high-efficient, low-costed, and
nondestructive model-based optical nanoscale method with the capability of measuring …

Ceramic metal art products are widely used in art and industry because of their unique
aesthetic value and functionality. However, these products are vulnerable to wear and …

High‐throughput through‐focus scanning optical microscopy (TSOM) involves defocusing
along the optical axis and capturing a series of defocus images and is useful in optical …

As semiconductors' critical dimension decreases, higher precision inspection instruments
are needed to detect defects in the manufacturing process. Optical inspection methods …