A review on IGBT module failure modes and lifetime testing

A Abuelnaga, M Narimani, AS Bahman - IEEE access, 2021 - ieeexplore.ieee.org
This article focuses on failure modes and lifetime testing of IGBT modules being one of the
most vulnerable components in power electronic converters. IGBT modules have already …

A review of DC fast chargers with BESS for electric vehicles: Topology, battery, reliability oriented control and cooling perspectives

H Polat, F Hosseinabadi, MM Hasan, S Chakraborty… - Batteries, 2023 - mdpi.com
The global promotion of electric vehicles (EVs) through various incentives has led to a
significant increase in their sales. However, the prolonged charging duration remains a …

A novel bond wire fault detection method for IGBT modules based on turn-on gate voltage overshoot

Y Yang, P Zhang - IEEE Transactions on Power Electronics, 2020 - ieeexplore.ieee.org
Bond wire degradation is one of the most common failure modes for wire-welded packaging
insulated-gate bipolar transistor (IGBT) modules. This article proposes a novel bond wire …

Online junction temperature measurement for SiC MOSFET based on dynamic threshold voltage extraction

X Jiang, J Wang, H Yu, J Chen, Z Zeng… - … on Power Electronics, 2020 - ieeexplore.ieee.org
The online junction temperature monitoring of power devices is a viable technique to ensure
the reliable operation of mission-critical power electronic converters. This article provides a …

Ensuring a reliable operation of two-level IGBT-based power converters: A review of monitoring and fault-tolerant approaches

K Hu, Z Liu, Y Yang, F Iannuzzo, F Blaabjerg - IEEE Access, 2020 - ieeexplore.ieee.org
Despite the emerging multi-phase and multi-level converters, two-level insulated gate
bipolar transistor-based power converters are still widely used in industrial applications in …

Design and optimization of a liquid cooled heat sink for a motor inverter in electric vehicles

F Han, H Guo, X Ding - Applied Energy, 2021 - Elsevier
The rapid development of power electronic devices has made them have higher power
density, which puts forward higher requirements for cooling technology. The contribution of …

Gate–emitter pre-threshold voltage as a health-sensitive parameter for IGBT chip failure monitoring in high-voltage multichip IGBT power modules

R Mandeya, C Chen, V Pickert… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
This paper proposes a novel health-sensitive parameter, called the gate-emitter pre-
threshold voltage VGE (pre-th), for detecting IGBT chip failures in multichip IGBT power …

Comparison of IGBT junction temperature measurement and estimation methods-a review

MHM Sathik, J Pou, S Prasanth, V Muthu… - … Asian conference on …, 2017 - ieeexplore.ieee.org
Recent growth of power semiconductor device market has been driven largely by the
growing demand for an efficient way to convert and distribute energy in the field of …

A novel converter-level IGBT junction temperature estimation method based on the bus voltage ringing

Y Yang, P Zhang - IEEE Transactions on Power Electronics, 2021 - ieeexplore.ieee.org
Insulated gate bipolar transistor (IGBT) junction temperature monitoring is crucial for
converter's healthy management and condition monitoring. However, most conventional …

Two decades of condition monitoring methods for power devices

G Susinni, SA Rizzo, F Iannuzzo - Electronics, 2021 - mdpi.com
Condition monitoring (CM) of power semiconductor devices enhances converter reliability
and customer service. Many studies have investigated the semiconductor devices failure …