(57) ABSTRACT A heat sink with angled fins comprising a first set of fins forming air
channels, a second set offins forming air channels and a heat sink base coupled to the first …

(57) ABSTRACT A heat sink assembly includes a heat sink (10), a fan cover (20) mounted
on the heatsink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) …

Prior Publication Data US 2006/OO6705O A1 Mar. 30, 2006 The present invention is a
method and an apparatus for (51) Int. Cl side-type heat dissipation. According to the present …

A heat sink includes a thermally conductive base, a plurality of thermally conductive fins
extending from the base, and a guiding member. The base has a top surface from which the …

A heat dissipation module includes a heat sink (40) mountable above a heat-generating
component, a fan duct (10), and a fan (50). The fan duct accommodating the heat sink …

A heat dissipation device is used for dissipating heat from a CPU and electronic
components. The heat dissipation device includes a heat absorbing portion for absorbing …

A heat dissipation device includes a heat sink, a fan adapter and a fan. The fan adapter has
two opposing sidewalls straight arranged thereof, a top wall disposed horizontally and …

According to one embodiment, a cooling device includes a cooling fan, a heat sink, an
inserting portion, a projection, and a holder. The inserting portion is provided on one of the …

In one embodiment, there is shown a heat transfer device having at least one ultra-dense
heat Sink, where the heat Sink is maintained in a position to be air flow direction neutral. In …

A heat sink having graduated lengths of fins, with the tallest fins being in the center of the
heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual …