Semiconductor devices and methods for manufacturing the same
J Lee, K Kim, R Kim, YOO Seungyong… - US Patent 11,587,867, 2023 - Google Patents
Semiconductor devices includes a first interlayer insulating layer, a lower interconnection
line in the first interlayer insulating layer, an etch stop layer on the first interlayer insulating …
line in the first interlayer insulating layer, an etch stop layer on the first interlayer insulating …
Titanium-containing diffusion barrier for cmp removal rate enhancement and contamination reduction
SK Fu, MH Lee, SL Shue - US Patent App. 17/869,702, 2022 - Google Patents
BACKGROUND [0002] Integrated circuits (ICs) contain numerous devices such as
transistors, diodes, capacitors and resistors that are fabricated on and/or in a semiconductor …
transistors, diodes, capacitors and resistors that are fabricated on and/or in a semiconductor …
Formation of metal vias on metal lines
RS Smith, K Wu, NLG Breil - US Patent 12,113,020, 2024 - Google Patents
Exemplary semiconductor processing methods include forming a via in a semiconductor
structure. The via may be defined in part by a bottom surface and a sidewall surface formed …
structure. The via may be defined in part by a bottom surface and a sidewall surface formed …