Inspection of defects in the printed circuit boards (PCBs) has both safety and economic
significance in the 4.0 industrial manufacturing. Nevertheless, it is still a challenging problem …

This article presents the novel design techniques for terahertz (THz) antenna-in-package
(AiP) to overcome issues resulting from multilayer printed circuit board (PCB)-based …

This paper presents a wideband dual-fed/dual-polarized sub-terahertz (THz) array antenna
design and D-band measurement system setup. The designed array is 4*1 linear array …

This work presents the design, creation, and testing of ultrawideband millimeter-wave
(mmWave) antennas with a tightly coupled array (TCA) configuration. These antennas are …

Silicon‐based packaging is highly suitable for miniaturised and cost‐effective integrated
systems. However, traditional silicon‐based antenna‐in‐package (AiP) has disadvantages …

This paper presents the broadband communication capability of a millimeter-wave
(mmWave) ultrawideband tightly coupled array (TCA) antenna based on high-density …

In this letter, a new modeling method based on the improved GDS file and the
corresponding tech file is proposed for the integrated passive devices (IPDs). The new …

A mmWave antenna-in-package (AiP) design for a tightly connected bowtie array antenna
using glass integrated passive device (GIPD) technology on a multilayer printed-circuit …

This paper introduces new impedance matching technique for via transition of multi-layer
PCB based sub-THz antenna-in-package (AiP). In the proposed design, multiple resonating …

This article presents a 77 GHz series-fed patch antenna array with bandwidth and gain. The
proposed chip antenna utilizes the TSMC 180 nm CMOS process. The antenna structure …