This paper introduces a novel approach to address thermal management challenges in
system-in-package (SiP) technology, which is a significant concern in various advanced …

We present in this paper a new modified version of the System-in-Package (SiP) model
based on three-layer chips. The idea is to add copper layers permitting to take up its thermal …

This study introduces a modified dynamic multiphysics modeling framework to characterize
the electromagnetic-electrothermal (EET) coupled behavior of a power conversion system …

This article presents a data-driven methodology for modeling DC–DC power electronic
converters. Using the proposed methodology, the dynamics of a converter can be captured …

The design of thermal management for medium voltage (MV) drives is an important subject
that requires computationally intensive and time consuming simulations. This paper …

This chapter discusses the challenges and opportunities involved in the thermal modeling
and simulation of advanced three-dimensional integrated circuit (3DIC) systems based on …

Power throttling with dynamic voltage and frequency scaling (DVFS) is important to the
dynamic thermal management (DTM) of processors. With increasing numbers of on-chip …

In the “More than Moore” era, performance requirements for leading edge semiconductor
devices are demanding extremely fine pitch interconnection in semiconductor packaging …

Multiple heat sources and complex thermal coupling exist in a highly integrated system in
package (SiP), making it difficult to predict the junction temperature inside a multi-chip SiP …