The lithium aluminosilicate system (LAS) is being explored for almost seven decades due to
its anomalous and attractive properties (especially low/negative thermal expansion and fast …

Due to their high isolation, low insertion loss, high linearity, and low power consumption,
microelectromechanical systems (MEMS) switches have drawn much attention from …

Over the past decades, optical technologies have entered neural implant technologies.
Applications such as optogenetics, near-infrared spectroscopy (NIRS), and direct-near …

Au-Au surface activated bonding (SAB) using ultrathin Au films is effective for room-
temperature pressureless wafer bonding. This paper reports the effect of the film thickness …

As an encapsulation material, glass has been used in electronic encapsulation, aerospace,
and fuel cell applications due to its ease of fabrication, heat resistance, and stability …

In this paper, a novel wafer-level hermetic packaging technology for heterogeneous device
integration is presented. Hermetic sealing is achieved by low-temperature thermo …

This paper reports a laterally vibrating MEMS resonant vacuum sensor which senses
ambient pressure based on the squeeze-film damping effect. The single-anchored double …

We present the novel 3D wafer-level vacuum packaging technology for MEMS, which only
needs two masks and is realized by Au-Si eutectic bonding with a low-resistivity Si Cap …

This work demonstrates the potential use of Cu-Sn-In metallurgy for wafer-level low-
temperature solid-liquid interdiffusion (LT-SLID) bonding process for …

This paper presents fabrication and packaging of a capacitive micromachined ultrasonic
transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC) …