Materials for printed circuit boards

T Amla, SJ Pastine - US Patent 11,596,066, 2023 - Google Patents
RNFJDJUURJAICM-UHFFFAOYSA-N 2, 2, 4, 4, 6, 6-hexaphenoxy-1, 3, 5-triaza-2$ l^{5}, 4$
l^{5}, 6$ l^{5}-triphosphacyclohexa-1, 3, 5-triene Chemical compound N= 1P (OC= 2C= CC …

Polymer compositions and their uses

T Amla, SJ Pastine - US Patent 11,359,062, 2022 - Google Patents
US11359062B1 - Polymer compositions and their uses - Google Patents US11359062B1 -
Polymer compositions and their uses - Google Patents Polymer compositions and their uses …

High Tg epoxy formulation with good thermal properties

D Bedner, T Amla - US Patent 10,364,332, 2019 - Google Patents
Varnish compositions and prepregs and laminates made therefrom wherein the varnish
compositions include at least one first epoxy resin and at least one second epoxy resin that …

Materials for printed circuit boards

T Amla, SJ Pastine - US Patent 11,930,596, 2024 - Google Patents
US11930596B2 - Materials for printed circuit boards - Google Patents US11930596B2 - Materials
for printed circuit boards - Google Patents Materials for printed circuit boards Download PDF …

Polymer compositions and their uses

T Amla, SJ Pastine - US Patent 11,820,875, 2023 - Google Patents
US11820875B2 - Polymer compositions and their uses - Google Patents US11820875B2 -
Polymer compositions and their uses - Google Patents Polymer compositions and their uses …

High Tg epoxy formulation with good thermal properties

D Bedner, T Amla - US Patent 11,155,687, 2021 - Google Patents
Varnish compositions and prepregs and laminates made therefrom wherein the varnish
compositions include at least one first epoxy resin and at least one second epoxy resin that …