Molecular dynamics simulation of the direct bonding of (111)-oriented nanotwinned Cu and its related mechanical behavior
CD Wu, CF Liao - Journal of Physics and Chemistry of Solids, 2024 - Elsevier
The effects of the bonding temperature and interference amount (extent of contact between
two Cu microbumps during the bonding process) on the bonding mechanism and …
two Cu microbumps during the bonding process) on the bonding mechanism and …
Fabrication of Porous Cu-Sn Microbumps for Low Temperature Cu-Cu Bonding
Z Wang, Y Shi, Q Wang, Z Wang - IEEE Transactions on …, 2025 - ieeexplore.ieee.org
Cu-Cu thermocompression bonding (TCB) is widely used in 3D integration due to its
excellent electrical performance, high bonding strength, and good reliability. However, TCB …
excellent electrical performance, high bonding strength, and good reliability. However, TCB …
[HTML][HTML] Impact of magnetic field variation on thermally annealed tantalum-filled vertical superconducting interconnects for scalable quantum computing systems
Efforts to scale down advanced quantum processors with more numbers of qubits offer
challenges since the integration of qubits is a significant obstacle in the path …
challenges since the integration of qubits is a significant obstacle in the path …
[PDF][PDF] Development of a Microwave Imaging System for Brain Injury
W Guo - 2023 - kclpure.kcl.ac.uk
This thesis presents the development of a microwave imaging (MWI) system for medical
diagnostics, focusing on the design and optimisation of the antenna system. MWI technology …
diagnostics, focusing on the design and optimisation of the antenna system. MWI technology …
Design and analysis of UWB microstrip antenna with notch-band characteristics
UMA Almukhtar - 2022 - openaccess.altinbas.edu.tr
Wireless communication technology has advanced, and it has been used for a wide range of
domestic, commercial, and even military applications. The UWB system, which uses …
domestic, commercial, and even military applications. The UWB system, which uses …