This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …

This study investigates the impacts of various heat sink design parameters on the thermal
dissipation performance of semiconductor packages using a heat sink as the thermal …

Purpose This study aims to investigate the reliability issues of microvoid cracks in solder
joint packages exposed to thermal cycling fatigue. Design/methodology/approach The …

This paper proposes a novel signal processing method using electromechanical (EM)
responses to collect pristine multilayer ceramic capacitors (MLCCs). EM response in MLCCs …

Abstract During qualification, a Printed Circuit Board (PCB) must pass several electrical and
thermomechanical tests. Among the tests required by the European Cooperation for Space …

Purpose This study aims to investigate the design configuration for an optimum solder height
of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Design/methodology …

Purpose This study aims to investigate the thermal fracture mechanism of moisture-
preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and …

This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints
under accelerated thermal cycling, considering the impacts of solder alloy and temperature …

Purpose This study aims to investigate the possible defects and their root causes in a soft-
termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow …

This study aims to detect micro defects in Multilayer Ceramic Capacitors (MLCC) using a
new signal processing method for Electromechanical (EM) responses. Microscopic defects …