Effects of Corner/Edge Bond and Side-fill for Automotive MCM Applications
KH Heish, CC Chan, MJ Wu, CY Weng… - 2022 17th …, 2022 - ieeexplore.ieee.org
For the high reliability and harsh environment applications such as automotive grade MCM
(multi-chip modules) or SiP (System in Package), normally requires under-fill to achieve the …
(multi-chip modules) or SiP (System in Package), normally requires under-fill to achieve the …
A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement …
H Shi, C Tian, D Yu, T Ueda - 2012 13th International …, 2012 - ieeexplore.ieee.org
The low coefficient of thermal expansion (CTE), high modulus and high glass transition
temperature (T g) underfills with silica filler have been successfully used for extending the …
temperature (T g) underfills with silica filler have been successfully used for extending the …
Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills
HB Shi, T Ueda - 2011 IEEE 13th Electronics Packaging …, 2011 - ieeexplore.ieee.org
A design of experiments was conducted to determine the thermal cycling reliability of full and
partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried …
partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried …
Polymeric reinforcement approaches and materials selection to improve board-level drop reliability of SnAgCu soldered area array packages
The board-level drop performance of area array package (AAP) assemblies is becoming
increasingly critical due to the shift from desktop to mobile computing. Furthermore …
increasingly critical due to the shift from desktop to mobile computing. Furthermore …
Physics based requirements for qualification of BGA components in temperature cycling
R Han, M Vujosevic, M Pei - International …, 2015 - asmedigitalcollection.asme.org
This paper discusses a new approach for definition of temperature cycling qualification
requirement that accounts for the physics of the deformation process in use condition and in …
requirement that accounts for the physics of the deformation process in use condition and in …
Investigation of the Board Level Underfill with the Digital Image Correalation Technique–Thermal Fatigue
P VAN LAI - 2020 - search.proquest.com
The electronics package trend is toward miniaturization. To meet the demand for high
bandwidth chips and to reduce I/O latency and energy consumption, advanced packages …
bandwidth chips and to reduce I/O latency and energy consumption, advanced packages …