Chemical mechanical polishing (CMP) is an essential planarization process for
semiconductor manufacturing. The application of CMP has been increasing in …

Conspectus Since first hypothesizing the existence of nanobubbles (NBs) in 1994, the
empirical study of NB properties and commercialization of NB generators have rapidly …

Metal-based nanoparticles (NPs) can be found in wastewater streams, which are significant
pathways for the release of NPs to the environment. Determination of the NPs concentration …

Marine oil spills and petrochemical discharges occurring either naturally or deliberately can
have destructive impacts on environment and economy of a nation. Water bodies …

Conventional coagulation and flocculation processes applied for semiconductor industry
wastewater treatment contributes to high operating cost due to the use of chemical …

This chapter describes the occurrence, behavior, and treatment of wastewater that is
produced by the Chemical Mechanical Planarization (CMP) process when it is used to …

The study sheds light on the interaction between chitosan (Ch) and polyglycidol (PGL) and
uses their interpolymer complex in hydrophilic coating of iron oxide particles (M). Preliminary …

Safe drinking water is one of the fundamental necessities for all living being on the earth.
Ever-growing population, industrialization, water sources disorganization, and global …

The semiconductor industry annually uses thousands of tons of nanoparticles (NPs) in
chemical mechanical polishing (CMP) processes. When III/V materials are processed with …

Advanced packaging is being driven by the need for computing power, thus, the reliability of
these systems needs to be addressed. The wide range of organic and inorganic materials …