Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study
KS Siow, YT Lin - Journal of Electronic Packaging, 2016 - asmedigitalcollection.asme.org
Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part
of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill …
of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill …
Factors influencing Al-Cu weld properties by intermetallic compound formation
P Kah, C Vimalraj, J Martikainen… - International Journal of …, 2015 - Springer
Dissimilar welding of aluminium (Al) and copper (Cu) has many applications in the electric
power, electronic and piping industries. The weldments in these applications are highly …
power, electronic and piping industries. The weldments in these applications are highly …
Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
Thermal cycling aging studies on a lead-free 95.5 Sn–3.8 Ag–0.7 Cu solder joint were
investigated. Soldered lap joint specimens were fabricated by a solder reflow process using …
investigated. Soldered lap joint specimens were fabricated by a solder reflow process using …
Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5 Ag solder/Cu joints
The mechanical behavior of Sn-rich solder/Cu joints is highly sensitive to processing
variables such as solder reflow time, cooling rate, and subsequent thermal aging. In this …
variables such as solder reflow time, cooling rate, and subsequent thermal aging. In this …
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints
Intermetallic compound (IMC) growth was investigated under isothermal aging condition at
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …
Microstructure and properties of Cu/Al joints brazed with Zn–Al filler metals
JI Feng, S Xue, J Lou, Y Lou, S Wang - Transactions of Nonferrous Metals …, 2012 - Elsevier
The mechanical properties and microstructural distribution of the Cu/Al brazing joints formed
by torch-brazing with different Zn–Al filler metals were investigated. The microstructure of the …
by torch-brazing with different Zn–Al filler metals were investigated. The microstructure of the …
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
Abstract Solders based on Sn-Ag alloys are susceptible to microstructural coarsening during
storage or service, resulting in evolution of joint properties, and hence reliability, over time …
storage or service, resulting in evolution of joint properties, and hence reliability, over time …
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
Solid-state intermetallic compound (IMC) growth behavior plays an important role in solder
joint reliability of electronic packaging assemblies. The morphology and growth of interfacial …
joint reliability of electronic packaging assemblies. The morphology and growth of interfacial …
[HTML][HTML] Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition
Abstract The Sn–3.0 wt.% Ag–0.5 wt.% Cu (SAC305)-xSiC composite solder was prepared
by powder metallurgy method with the addition of SiC ceramic reinforcement with various …
by powder metallurgy method with the addition of SiC ceramic reinforcement with various …
A review of nanoporous metals in interconnects
Interconnections in semiconductor devices need to provide a seamless electrical, thermal,
and mechanical link to different parts of the circuit. Since the move away from lead-based …
and mechanical link to different parts of the circuit. Since the move away from lead-based …