Solder joint reliability of lead free solders (Sn-Ag-Cu) in drop testing has been an issue in
mobile and handheld electronics. Since lead free solders have lower drop performance …

In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to
rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and …

Product durability due to drop shock is a critical element for assessment of reliability for
handheld devices. So far, no simulation model for a board-level drop has been extensively …

Failure modes and mechanisms under mechanical shock loading were studied by
employing the statistical and fractographic research methods, and the finite element (FE) …

Lead free solder joints used in surface mount packages like ball grid array (BGA) have a
great impact on the reliability of the end product. In accelerated thermal cycling (ATC) tests …

Green electronic products require the use of lead-free (Pb-free) solder materials for
soldering. Semiconductor packaging and electronics manufacturing employ Pb-free solder …

Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free
Solder Joints Page 1 6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic …

The effect of mechanical shock impacts is a key factor in the reliability of modern handheld
products. Due to differences in product enclosures, impact orientations, strike surfaces and …

We present an investigation into the effect of the motion of a printed circuit board (PCB) on
the response of a microelectromechanical system (MEMS) device to shock loads. A two …

High strain-rate drop impact tests were performed on ball grid array (BGA) packages with
solder compositions of (in wt%) Sn-3.8 Ag-0.7 Cu (SnAgCu) and eutectic Sn-37Pb (SnPb) …