In one innovative aspect, the invention relates to a semiconductor package. In one
embodiment, the semicon ductor package includes a die pad, a plurality of leads, a …

The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality
of wires, and a molding compound. The carrier includes a die pad and a plurality of leads …

A semiconductor device in the preferred embodiment includes: a lead frame comprising a
die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface …

A semiconductor device includes a lead frame; a semiconductor chip mounted on the lead
frame; and an encapsulation resin, wherein a convexo-concave portion including a plurality …

BACKGROUND The present invention relates to a semiconductor device and a production
method thereof; in particular a technology effective when it is applied to a semiconductor …

One aspect of the invention pertains to a semiconductor die with rounded sidewall junction
edge corners. Such rounding reduces stress accumulations at those corners. In other …

(57) ABSTRACT A package and method of making thereof. The package includes a? rst
plated area, a second plated area, a die, a bond, and a molding. The die is attached to the …

A semiconductor package and related methods are described. In one embodiment, the
package includes a die pad, a plural ity of leads, a chip, and a package body. The die pad …

(57) ABSTRACT A method and apparatus are described for fabricating a microchip structure
(70) which protects interior electrical integrated circuits and components (120) attached to a …

A package structure and related methods are described. In one embodiment, the package
structure includes a chip, a plurality of leads disposed around and electrically coupled to the …