A review: On the development of low melting temperature Pb-free solders

HR Kotadia, PD Howes, SH Mannan - Microelectronics Reliability, 2014 - Elsevier
Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …

Structure and properties of lead-free solders bearing micro and nano particles

L Zhang, KN Tu - Materials Science and Engineering: R: Reports, 2014 - Elsevier
Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3. 5Ag0. 5Cu solder

LC Tsao, SY Chang, CI Lee, WH Sun, CH Huang - Materials & Design, 2010 - Elsevier
This work investigates the effects of nano-Al2O3 on the microstructure and microhardness of
the Sn3. 5Ag0. 5Cu composite solder alloy. In comparison with solder without the addition of …

Research advances in nano-composite solders

J Shen, YC Chan - Microelectronics Reliability, 2009 - Elsevier
Recently, nano-composite solders have been developed in the electronic packaging
materials industry to improve the creep and thermo-mechanical fatigue resistance of solder …

Effect of graphene nanosheets reinforcement on the performance of Sn Ag Cu lead-free solder

XD Liu, YD Han, HY Jing, J Wei, LY Xu - Materials Science and …, 2013 - Elsevier
Varying weight fractions of graphene nanosheets were successfully incorporated into lead-
free solder using the powder metallurgy route. The effects of graphene nanosheets on the …

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3. 5Ag0. 25Cu solder

LC Tsao, SY Chang - Materials & Design, 2010 - Elsevier
For development of a lead-free composite solder for advance electrical components, a
series of Sn3. 5Ag0. 25Cu (SAC) solders containing TiO2 nanopowders have been studied …

Interfacial intermetallic growth and shear strength of lead-free composite solder joints

SML Nai, J Wei, M Gupta - Journal of Alloys and Compounds, 2009 - Elsevier
In the present study, varying weight percentages of carbon nanotubes (CNTs) were
incorporated into Sn–Ag–Cu solder matrix, to form composite solders. Isothermal aging …

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

AK Gain, YC Chan, WKC Yung - Microelectronics Reliability, 2011 - Elsevier
Nano-sized, nonreacting, noncoarsening ZrO2 particles reinforced Sn–3.0 wt% Ag–0.5 wt%
Cu composite solders were prepared by mechanically dispersing ZrO2 nano-particles into …

Composite lead-free electronic solders

KN Subramanian, F Guo - Lead-Free Electronic Solders: A Special Issue …, 2007 - Springer
Composite approaches have been developed in lead-free solder research in an effort to
improve the service temperature capabilities and thermal stability of the solder joints. This …

Development of SnAg-based lead free solders in electronics packaging

L Zhang, C He, Y Guo, J Han, Y Zhang… - Microelectronics …, 2012 - Elsevier
Lead free solder alloys for electronic assembly is being driven by environmental and health
concerns regarding toxicity of lead and, more importantly, by the perceived economic …