R Su, Z Chen, M Ke, D Gao… - … on Electron Devices, 2024 - ieeexplore.ieee.org
The mobility scattering mechanisms in the ultra-thin-body (UTB) Ge-OI p-and n-MOSFETs have been systematically investigated. It is found that the dependence is confirmed for the …
J Jeong, SK Kim, YJ Suh, J Shim… - … on Electron Devices, 2024 - ieeexplore.ieee.org
Heterogenous and monolithic 3-D (M3D) integration of III–V RF devices on Si CMOS is a very attractive technology for future wireless communication systems. However, the self …
SK Kim, HR Lim, J Jeong, SW Lee… - … on Electron Devices, 2023 - ieeexplore.ieee.org
In this study, we report on the fabrication and characterization of 3-D sequential complementary field-effect-transistors (CFETs) using the direct wafer bonding (DWB) …
R Kaur, NR Mohapatra - IEEE Transactions on Electron …, 2024 - ieeexplore.ieee.org
We explored the performance of p-type nanosheet FETs (NsFETs) with sheet thickness scaling using a well-calibrated subband BTE solver that accounts for quantum confinement …
SH Kim, SH Lee, WJ Lee, JW Park… - Electronics and …, 2023 - koreascience.kr
With semiconductor scaling approaching the physical limits, devices including CMOS (complementary metal-oxide-semiconductor) components have managed to overcome yet …