Surface tension-driven self-alignment is a passive and highly-accurate positioning
mechanism that can significantly simplify and enhance the construction of advanced …

A theoretical study and experimental validation of the evaporation of a droplet confined
between two parallel square chips with a free-standing top chip over a water meniscus is …

In the context of microelectronics, the ongoing trend of reducing interconnect pitch sizes to
sub-micron levels presents a burgeoning challenge in die-to-wafer assembly. This …

Self-aligned assembly, making use of capillary forces, is considered as an alternative to
active alignment during thermo-compression bonding of Si chips in the 3D heterogeneous …

Room temperature and pressure bonding is shown for wafer-to-wafer (W2W) bonding but
never for small chips. Usually, thermo-compression bonding (TCB) is employed for die-to …

We have explored two nanofabrication techniques in this thesis–Jet-and-Flash Imprint
Lithography (J-FIL), and Nano-precise Modular Assembly of Pre-fabricated blocks (N-MAP) …