Wafer bonding is a highly effective technique for integrating dissimilar semiconductor
materials while suppressing the generation of crystalline defects that commonly occur during …

Multijunction (MJ) solar cells achieve very high efficiencies by effectively utilizing the entire
solar spectrum. Previously, we constructed a III‐V//Si MJ solar cell using the smart stack …

Multijunction (MJ) solar cells have attracted considerable attention as next‐generation solar
cells. III–V‐based MJ solar cells connected to heterogeneous cells, such as GaAs//Si and …

Hybrid integration of multiple optical chips in three dimensions is an important technology for
realizing highly functional, compact optoelectronic microsystems. In this paper, we report …

In this study, room-temperature wafer bonding of Al2O3 thin films on Si thermal oxide wafers,
which were deposited using atomic layer deposition (ALD), was realized using the surface …

Au-Au surface activated bonding (SAB) using ultrathin Au films is effective for room-
temperature pressureless wafer bonding. This paper reports the effect of the film thickness …

Multijunction (MJ) solar cells achieve high efficiencies by effectively utilizing the solar
spectrum. Previously, we have developed III‐V MJ solar cells using smart stack technology …

We proposed a room-temperature wafer-bonding method using activated Si atomic layer
and verify its effectiveness for the fabrication of glass-or sapphire-based LiNbO 3-on …

Wafers with smooth Au thin films (rms surface roughness:< 0.5 nm, thickness:< 50nm) were
successfully bonded in ambient air at room temperature after an Ar radio frequency plasma …

Lithium niobate-on-insulator (LNOI) waveguides fabricated on a silicon wafer using a room-
temperature bonding method have potential application as Si-based high-density photonic …