(57) ABSTRACT A method of fabricating a die containing an integrated circuit, including
active components and passive components, includes producing a first Substrate containing …

BACKGROUND 0002 Wafer-level processing continues to evolve as new applications are
both desired and realized. In certain instances, it is useful to provide a protective structure or …

An apparatus may include a first substrate, one or more microelectromechanical systems
(MEMS) coupled to the first substrate, a second substrate coupled with the first substrate …

Packaging of MEMS and other devices, and in some cases, devices that have vertically
extending structures. Robust packaging solutions for such devices are provided, which may …

5,656,778 A 8, 1997 ROSZhart 6,892,575 B2 5/2005 Nasiri et al. 5,659,195 A 8, 1997 Kaiser
et al. 6,915,693 B2 7/2005 Kim et al. 5,703.292 A 12/1997 Ward 6,918,297 B2 7/2005 …

(57) ABSTRACT A method for self-supported transfer of a finelayer, in which at least one
species of ions is implanted in a source-substrate at a specified depth in relation to the …

A stacked die package for an electromechanical resonator system includes a chip that
contains an electromechanical resonator bonded onto the control chip for the …

A method for preparing a thin layer of GaN from a starting substrate in which at least one
thick surface area extending along a free face of the starting substrate includes GaN, where …

Method of fabricating a microelectronic structure includes preparing a first structure having a
first material different from silicon on a surface thereof and forming at least one covering …

A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The
movable member of the MEMS device is attached at the side up against the circuit chip. The …