A wafer level package (WLP) that has a flip chip form and uses thin-film redistribution with
solder bumps to connect the package to the printed wiring board directly is discussed in this …

In this paper, three kinds of constitutive laws, elastic,“cure hardening instantaneously linear
elastic (CHILE)” and viscoelastic law, are used to predict curing process-induced residual …

To improve the production yield rate, reliability is one of the important indicators of electronic
packaging products. In past research, however, the influence of the fabrication process was …

During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …

Both cure deformations and residual stresses of 3D braided composites are studied based
on the representative volume element (RVE) by means of thermochemical and …

In this paper, two kinds of transient models, the viscoelastic model and the linear elastic
model, are established to analyze the curing deformation of the thermosetting resin …

A three-dimensional steady-state inverse heat conduction-convection conjugated problem
(IHCCCP) is investigated in this work. The goal is to estimate the unknown spatially …

This study provides an in-depth simulation of the capillary underfill (CUF) process for flip-
chip packages using Moldex3D, offering a comprehensive analysis that integrates material …

The isothermal and isobaric volume shrinkage is measured by a single-plunger-type
dilatometer for epoxy molding compound (EMC). This device has been found suitable for …

Microdroplet-jet 3D printing constructs functional devices by layering and curing materials
through spraying. However, thermal stresses accumulated during curing can cause warping …