Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging
industry due to environmental concerns. Both electromigration (EM) and thermomigration …

Lead free solder alloys for electronic assembly is being driven by environmental and health
concerns regarding toxicity of lead and, more importantly, by the perceived economic …

An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …

The anisotropy of β-Sn grain is becoming the most crucial factor to dominate the
electromigration (EM) behavior with the downsizing of solder bumps. When the c-axis of β …

Soldering to Cu interconnect pads with Sn-containing alloys usually leads to the formation of
a layered Cu3Sn/Cu6Sn5 structure on the pad/solder interface. Frequently, microscopic …

Microbumps in three-dimensional integrated circuit now becomes essential technology to
reach higher packaging density. However, the small volume of microbumps dramatically …

This paper presented integrated electromigration (EM) studies through experiment, theory,
and simulation. First, extensive EM tests were performed using Blech and standard wafer …

A comprehensive kinetic analysis was established to investigate the electromigration (EM)
enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free …

Thermomigration (TM) has become a critical reliability issue in advanced electronic
packaging because of Joule heating. A temperature gradient is required to conduct heat …

Void nucleation is a critical issue in wetting because it negatively impacts the solder joint
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …