This paper examines multiscale theories and numerical methods for interconnect materials
in electronic packaging, focusing on the interplay among micro-scale morphology, meso …

The interconnecting solder is a key control factor for the reliability of electronic power
packaging because it highly affects the junction temperature of insulated-gate bipolar …

During the unclamped inductive load switching (UIS) testing or system application of power
SGT-MOSFET, it is found that the step leap of drain voltage occurs during clamping at high …

To exploit the potential of wide-bandgap semiconductors in high-frequency applications,
innovative packaging designs are developed to minimize the parasitic inductance of power …

This article presents a novel torque senor, which functions according to the deformation of a
printed circuit board that carries sensitive elements and can also serve as a sensor. The …

Current fatigue models for predicting the cycles to failure (fatigue life) of solder joints under
thermo-mechanical loadings can only provide point estimates of the characteristic life or …

Polymer adhesion promoters were formulated to improve the adhesion strength of lead
frame/epoxy composites. The poly (itaconic acid‐co‐acrylamide)(IAcAAM) was synthesized …

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of
power components | Emerald Insight Books and journals Case studies Expert Briefings Open …

Electrochemical deposited (ECD) thick film copper on silicon substrate is one of the most
challenging technological brick for semiconductor industry representing a relevant …

Nowadays, solder reliability in new power electronic packages is an important research
topic. Therefore, it is of paramount importance to properly understand and model the …