Wafer bonding with intermediate polymer adhesives is an important fabrication technique for
advanced microelectronic and microelectromechanical systems, such as three-dimensional …

In this study, we report high performance organic solar cells with spray coated hole‐
transport and active layers. With optimized ink formulations we are able to deposit films with …

In this work we have performed a detailed study of the influence of various parameters on
spray coating of polymer films. Our aim is to produce polymer films of uniform thickness (500 …

In this paper, a new method of photoresist coating, direct spray coating, is studied. This
method is especially suited to coat high topography surfaces for some special applications …

We utilise spray-coating under ambient conditions to sequentially deposit compact-TiO2,
mesoporous-TiO2, CH3NH3PbI (3− x) Clx perovskite and doped spiro-OMeTAD layers …

Aiming at topographical surface micromachining of metallic and in particular Ti surfaces, we
have investigated the possibility of using robust SU-8 and more recent electrophoretic …

A working prototype of integrated fiber/receiver system for optical data transmission is
realized. The prototype is made by directly depositing an organic photodetector onto a …

Planar or two-dimensional (2D) microelectrode arrays (MEAs), which are used for in vitro
culturing of neurons and tissue slices, have been in existence for over 30 years. However, in …

A novel flexible strain gauge sensor was successfully screen printed on polyethylene
terephthalate (PET) substrate using silver (Ag) ink as metallization. The electro-mechanical …

We have developed a MEMS probe-card technology for wafer-level testing ICs with 1-D line-
arrayed or 2-D area-arrayed dense pads layouts. With a novel metal MEMS fabrication …