Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods
In this paper, we present the thermal cycling test results for edge and corner bonded lead-
free PSvfBGAs on a high-Tg test board. The test results show that the characteristic lives of …
free PSvfBGAs on a high-Tg test board. The test results show that the characteristic lives of …
[HTML][HTML] Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
Printed circuit boards (PCBs) assembled with ball grid array (BGA) microelectronics
packages were tested in a double cantilever beam (DCB) configuration. The results were …
packages were tested in a double cantilever beam (DCB) configuration. The results were …
[HTML][HTML] Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling
The bending strength of underfilled and edge-bonded ball grid array (BGA) microelectronic
packages assembled on printed circuit boards (PCBs) was compared using double …
packages assembled on printed circuit boards (PCBs) was compared using double …
Board-level shear, bend, drop and thermal cycling reliability of lead-free chip scale packages with partial underfill: a low-cost alternative to full underfill
Full capillary flow underfill (FCFU) has been proven to be effective in improving the board-
level mechanical reliability of lead-free (LF) area array packages (AAPs). However, the …
level mechanical reliability of lead-free (LF) area array packages (AAPs). However, the …
A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement …
H Shi, C Tian, D Yu, T Ueda - 2012 13th International …, 2012 - ieeexplore.ieee.org
The low coefficient of thermal expansion (CTE), high modulus and high glass transition
temperature (T g) underfills with silica filler have been successfully used for extending the …
temperature (T g) underfills with silica filler have been successfully used for extending the …
Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills
HB Shi, T Ueda - 2011 IEEE 13th Electronics Packaging …, 2011 - ieeexplore.ieee.org
A design of experiments was conducted to determine the thermal cycling reliability of full and
partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried …
partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried …
Predicting delamination in multilayer composite circuit boards with bonded microelectronic components
The present work developed a mixed-mode cohesive zone model (CZM) with a mode I
failure criterion to predict the delamination bending loads of multilayer, composite printed …
failure criterion to predict the delamination bending loads of multilayer, composite printed …
Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly
HB Shi, T Ueda - 2011 IEEE 13th Electronics Packaging …, 2011 - ieeexplore.ieee.org
This paper discusses the Min. sampling rate of strain measurement during the system
assembly process. The test boards including the server, desktop computer and laptop …
assembly process. The test boards including the server, desktop computer and laptop …
The effect of metallic interconnect spacing on the thermal resistance of flip-chip light-emitting diodes with underfill encapsulation
While highly thermally conductive underfill material has been proposed as a solution for
reducing the thermal resistance of flip-chip light-emitting diode (FCLED) packages, studies …
reducing the thermal resistance of flip-chip light-emitting diode (FCLED) packages, studies …
Polymeric reinforcement approaches and materials selection to improve board-level drop reliability of SnAgCu soldered area array packages
The board-level drop performance of area array package (AAP) assemblies is becoming
increasingly critical due to the shift from desktop to mobile computing. Furthermore …
increasingly critical due to the shift from desktop to mobile computing. Furthermore …