Conspectus Electronics manufacturing involves Cu electrodeposition to form 3D circuitry of
arbitrary complexity. This ranges from nanometer-wide interconnects between individual …

After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

Dynamic windows with adjustable tint give users control over the flow of light and heat to
decrease the carbon footprint of buildings and improve the occupants' comfort. Despite the …

Microneedle technologies have the potential for expanding the capabilities of wearable
health monitoring from physiology to biochemistry. This paper presents the fabrication of …

Abstract High‐performance Cu2ZnSnS4 photovoltaic devices are demonstrated using
electrodeposition of metal stacks and annealing of a CuZnSn precursor in a sulfur …

The oxides of cobalt have recently been shown to be highly effective electrocatalysts for the
oxygen evolution reaction (OER) under alkaline conditions. In general species such as …

Polyethylene glycol (PEG) is a typical suppressor in the presence of chloride anions for Cu
interconnect electroplating in the field of microelectronics manufacture, yet its adsorption …

" Liquid cell electron microscopy allows us to apply the powerful imaging and analysis
capabilities of the electron microscope to liquid samples, visualizing structures and …

The reaction and nucleation mechanisms of the electrodeposition of copper from
ammoniacal solutions were investigated by cyclic voltammetric (cv) and …

Three fundamental types of suppressor additives for copper electroplating could be
identified by means of potential transient measurements. These suppressor additives differ …