In the realm of military and defence applications, exposure to radiation significantly
challenges the performance and reliability of solder alloys and joints in electronic systems …

Abstract Sn3Ag0. 5Cu (SAC305) Ball Grid Array (BGA) solder joints were exposed to 60 Co
source gamma irradiation at a dose rate of 1 Gy (Si)/s from 0 to 200 h in air. The effects of …

Abstract Sn-Ag-Cu-based solder alloys are extensively employed in electronic packaging
applications, thus necessitating in-depth reliability studies in various environmental …

This paper highlights the advantages of using the nanoindentation approach over the
conventional method for the mechanical characterization of components used in electronic …

Purpose This paper aims to investigate the effect of different doses of gamma radiation on
the micromechanical response (hardness properties and creep behaviour) of 96.5 Sn-3.0 Ag …

Purpose The purpose of this paper is to investigate the effect of carbon nanotube (CNT)
addition on microstructure, interfacial intermetallic compound (IMC) layer and …

Electronic applications are now driving packaging technology that is equivalent to primary
computer packages for the past 25 years. The electronic application currently shows an …

Purpose The purpose of this paper is to discuss the effect of a blast wave on the
microstructure, intermetallic layers and hardness properties of Sn0. 3Ag0. 7Cu (SAC0307) …

Lead-free composite solders has attracted more attention as they are required in the
microelectronics industry to assure good electrical connections and the best mechanical …

Abstract The Cu-2 wt% Sb alloy was prepared and exposed to various heat treatments at
temperatures ranging from 573 to 973 K to get distinct grain diameters. Different samples of …