Photosensitive polyimide (PSPI) is widely used in semiconductors, panel displays, sensors,
3D printing, and other advanced manufacturing. Among various PSPIs, a class of PSPIs with …

Current methods for tuning the taper angle of photosensitive polyimide (PSPI) often require
additional equipment or materials, and has limited achievable angle tuning range while …

There is an increasing demand for polyimide (PI) with excellent mechanical properties, good
heat resistance, and low dielectric constant in integrated circuits and advanced packaging …

One challenge in the high‐performance dielectric material of polyimide (PI) is to obtain the
excellent comprehensive properties at low curing temperature for advanced IC package. In …

Photosensitive polyimides (PSPIs) have been widely used in the buffer coating layer and
insulation layer due to their excellent thermal and mechanical stability. In this work, a series …

Negative photosensitive polyimides (PSPIs) with the photo-patterned ability via the
photocrosslinking reactions induced by the i-line (365 nm) and h-line (426 nm) emitting …

The utilization of accelerators has been a common approach to prepare low‐temperature
curable polyimide (PI). However, the accelerators have gradually fallen out of favor because …

The traditional high-temperature preparation process of polyimide can cause many
problems and limits the wider application in extreme conditions. An important challenge to …

Photosensitive polyimides (PSPIs) have been widely developed in microelectronics, which
is due to their excellent thermal properties and reasonable dielectric properties and can be …

Photosensitive polyimide (PSPI) have been developed base on polyimide (PI). PSPI can be
used as insulating and protective materials in the microelectronics industry due to the …