Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection
The performance and reliability of electronic components and assemblies strongly depend
on their thermal state. The knowledge of the temperature distribution throughout the …
on their thermal state. The knowledge of the temperature distribution throughout the …
Investigation of different thermomechanical behaviours in one batch of QFN packages
A Tomas, H Frémont, N Malbert, N Labat… - … and Multi-Physics …, 2024 - ieeexplore.ieee.org
This paper investigates the influence of the position of the QFN packages during
manufacturing on their mechanical behaviour. The samples under test are representative of …
manufacturing on their mechanical behaviour. The samples under test are representative of …
Effects of the encapsulating resin on the junction temperature of the QFN16 and QFN32 electronic packages subjected to free convection
A Baïri, O Haddad, JP Guinart, K Adeyeye… - Heat Transfer …, 2018 - Taylor & Francis
The junction temperature of the quad flat no-lead with 16 and 32 leads (QFN16 and QFN32)
electronic packages subjected to free convection is highly affected by their encapsulating …
electronic packages subjected to free convection is highly affected by their encapsulating …
Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity
A Baïri - Microelectronics Reliability, 2017 - Elsevier
The thermal state of the electronic devices used in many engineering fields must be
controlled. The maximum temperature does not exceed the value recommended by the …
controlled. The maximum temperature does not exceed the value recommended by the …