Here, this paper completely examines the crosstalk noise of Through-Silicon-Vias (TSVs) in
high speed operations by means of a novel 3-Dimensional-IC Test structural design. In order …

5 D Integrated Circuit (2.5 D IC) is an advanced packaging technology. This technology
facilitates the dense integration of multiple dies by adding passive components to the silicon …

2.5-D integration is emerging as the precursor to stacked 3-D ICs. Since the silicon
interposer and micro-bumps in 2.5-D integration can suffer from fabrication and assembly …

Interposer-based 2.5 D integrated circuits (ICs) are seen today as a precursor to 3D ICs
based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5 D IC must be …

Interposer-based 2.5-D integrated circuits (ICs) are seen today as a first step toward the
eventual industry adoption of 3-D ICs based on through-silicon vias (TSVs). The TSVs and …

Through silicon vias (TSVs) play an important role in 3-D chip integration. Effective and
efficient testing for correct operation of TSVs is essential for 3-D integrated circuit design …

Technological advancements in multi-die, chiplet, or other 3D architecture design are
required to fulfill the high computational power needed for chips in the AI/meta world …

Interposer-based 2.5 D integrated circuits (ICs) are seen today as a precursor to 3D ICs
based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5 D IC must be …

Through Silicon Vias (TSV) play an important role in 3D chip integration. Its features include:
providing vertical interconnection, decreasing the area of routing, and increasing the …

Interposer-based 2.5 D integrated circuits (ICs) are seen today as a precursor to 3D ICs
based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5 D IC must be …