The bonding of dissimilar materials can make the joint possess the select performances of
two materials. Suitable brazing/soldering methods can be adopted for different materials and …

This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …

Induction heating has been widely applied in the energy and manufacturing industry for its
energy-saving, low-cost, local high-efficiency heating, and noncontact benefits. However …

This study investigates the impacts of various heat sink design parameters on the thermal
dissipation performance of semiconductor packages using a heat sink as the thermal …

The numerical results of this work provide an optimum design for a three-dimensional
natural convection heat sink on the bus duct conductor's casing. The size of the fin pitch is …

Electronics is the vital basis for innovations and the essential enabler for global trends like
connectivity, electro mobility and renewable energies. These applications require high …

This paper presents the study of infrared (IR) reflow oven characteristics for suitable
operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering …

Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …

This paper investigates the impact of various copper (Cu) pillar bump heights on
temperature distribution, deformation and thermal stress during reflow. The virtual reflow …

This article presents a finite volume-based simulation study on the effect of fin length
variation on the thermal performance of a bus duct conductor. The study was conducted by …