Application of UV dissolution imaging to pharmaceutical systems

B Brown, A Ward, Z Fazili, J Østergaard… - Advanced Drug Delivery …, 2021 - Elsevier
UV–vis spectrometry is widely used in the pharmaceutical sciences for compound
quantification, alone or in conjunction with separation techniques, due to most drug entities …

Ionizing Radiation Effectsin Electronics

M Bagatin, S Gerardin - 2016 - api.taylorfrancis.com
There is an invisible enemy that constantly threatens the operation of electronics: ionizing
radiation. From sea level to outer space, ionizing radiation is virtually everywhere. At sea …

[HTML][HTML] The integration of microelectronic and photonic circuits on a single silicon chip for high-speed and low-power optoelectronic technology

R Gupta, A Kumar, M Kumar, R Singh, A Gehlot… - Nano Materials …, 2024 - Elsevier
The combining microelectronic devices and associated technologies onto a single silicon
chip poses a substantial challenge. However, in recent years, the area of silicon photonics …

Reduction of dark current in CMOS image sensor pixels using hydrocarbon-molecular-ion-implanted double epitaxial Si wafers

A Onaka-Masada, T Kadono, R Okuyama, R Hirose… - Sensors, 2020 - mdpi.com
The impact of hydrocarbon-molecular (C3H6)-ion implantation in an epitaxial layer, which
has low oxygen concentration, on the dark characteristics of complementary metal-oxide …

Characterization and analysis of electrical crosstalk in a linear array of CMOS image sensors

M Khabir, MA Karami - Applied Optics, 2022 - opg.optica.org
In this paper, the influences of the depth and width of the oxide trench isolation between
pixels, pixel epitaxial layer thickness for different impurity doping concentrations, and light …

Optical detectors

L Nanver, T Knežević - Advances in Semiconductor …, 2022 - Wiley Online Library
In the context of More than Moore (MtM), an overview is given of optical detectors that are
either commercially available today or in advanced development. Focus is placed on the …

Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography

A Sundaram, CK Tew, GW Tan, YH Fu… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Advanced heterogeneous integration involves the stacking of multiple devices using direct
bond interconnect processes to achieve improved functionality. Typical fabrication …

Image and signal sensors for computing and machine vision: Developments to meet future needs

RD Jansen-van Vuuren, A Shahnewaz… - Machine Vision and …, 2020 - Springer
Image sensors used in current machine vision systems suffer from low dynamic range and
poor colour constancy and are brittle and unmalleable, limiting their use in applications for …

Curing Process on Passivation Layer for Backside-Illuminated CMOS Image Sensor Application

J Park, KK Choi, J An, B Kang, H You, G Hong… - IEEE …, 2023 - ieeexplore.ieee.org
We fabricated Al/Al 2 O 3/SiO 2/Si and Al/HfO 2/Si structures to optimize the passivation
layer of a backside-illuminated (BSI) complementary metal oxide semiconductor (CMOS) …

Performance and reliability degradation of CMOS Image Sensors in Back-Side Illuminated configuration

A Vici, F Russo, N Lovisi, A Marchioni… - IEEE Journal of the …, 2020 - ieeexplore.ieee.org
We present a systematic characterization of wafer-level reliability dedicated test structures in
Back-Side-Illuminated CMOS Image Sensors. Noise and electrical measurements …