Electrical Microneedles for Wound Treatment
Electrical stimulation has been hotpot research and provoked extensive interest in a broad
application such as wound closure, tissue injury repair, and nerve engineering. In particular …
application such as wound closure, tissue injury repair, and nerve engineering. In particular …
Highly Intrinsic Thermal Conductivity of Aramid Nanofiber Films by Manipulating Intermolecular Hydrogen Bonding Interactions
N Jiang, YY Song, LN Wang, WW Liu… - Advanced Functional …, 2024 - Wiley Online Library
Lightweight, flexible, and thermostable thermally conductive materials are essential for
enhancing heat dissipation efficiency in advanced electronics. The development of intrinsic …
enhancing heat dissipation efficiency in advanced electronics. The development of intrinsic …
Elucidating the Role of Polymer–Dopant Interaction in the Electrical Properties of Polymers with Non-Conjugated Spacers
F Zhong, H Li, Z Xu, S Luo, J Song… - ACS Applied Polymer …, 2024 - ACS Publications
Chemical doping of conductive polymers has been an important strategy to optimize the
electronic properties of thermoelectric materials. The precise control of doping is essential …
electronic properties of thermoelectric materials. The precise control of doping is essential …
Intrinsic Thermal Conductivity of Polyesters with Flexible Segments in Main Chains
P Yang, Y Wu, K Wang, X Zheng, J Wan… - The Journal of …, 2025 - ACS Publications
Polymers with high thermal conductivity are crucial for addressing the heat dissipation
challenges associated with high-performance compact electronic devices. In this work, a …
challenges associated with high-performance compact electronic devices. In this work, a …
High-performance soybean-oil and gallic acid-based UV-curable resins: Synthesis and application in thermal management materials
X Wang, F Bian, X Cai, J Hu, S Lin - Applied Surface Science, 2025 - Elsevier
The advent of the 5G era has significantly increased device power density and integration,
intensifying heat dissipation challenges in electronic devices. The exploration and …
intensifying heat dissipation challenges in electronic devices. The exploration and …
Composite SiO2 fillers improved by BN nanosheets coated with TiO2 nanoparticles for PTFE-based thermal interface materials with isotropic heat dissipation …
S Lv, F Han, S Yang, T Li, L Chen, J Ouyang… - Ceramics …, 2025 - Elsevier
High-frequency, high-speed and high-power-density electronic devices generate significant
heat accumulation, making thermal interface materials (TIMs) crucial for enhancing their …
heat accumulation, making thermal interface materials (TIMs) crucial for enhancing their …
Enhanced intrinsic thermal conductivity of liquid crystalline polyester dispersed films through hydrogen bond interaction
P Yang, Y Wu, K Wang, H Yang, J Wan, K Wu, P Hong… - Polymer, 2024 - Elsevier
Polymer-dispersed liquid crystal (MHxFy) films comprising liquid crystal polymer (LCPH and
LCPF) were successfully obtained by the method of solution casting & thermal compressing …
LCPF) were successfully obtained by the method of solution casting & thermal compressing …
Understanding thermal transport in polymer semiconductors via two-channel mechanism
The vibrational thermal conductivity of polymer semiconductors is crucial for the
performance of organic electronic devices, yet its underlying mechanisms remain elusive …
performance of organic electronic devices, yet its underlying mechanisms remain elusive …