This paper presents a miniature 50 mm 3 inertial measurement unit (IMU) implemented using a folded microelectromechanical systems (MEMS) process. The approach is based on …
This paper reports an approach for co-fabrication of silicon-on-insulator (SOI) sensors with low-resistance vertical electrical interconnects in thick (up to 600 μm) wafers. The thru-wafer …