Dual laser beam asynchronous dicing of 4H-sic wafer
Z Zhang, Z Wen, H Shi, Q Song, Z Xu, M Li, Y Hou… - Micromachines, 2021 - mdpi.com
SiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high
failure rate during the dicing process. In this study, a novel dual laser beam asynchronous …
failure rate during the dicing process. In this study, a novel dual laser beam asynchronous …
Image-based modeling of viscoelastic properties of solidifying Al alloys and model validation
A Matsushita, H Mizuno, T Okane, M Yoshida - Journal of Materials …, 2019 - Elsevier
The method to predict the viscoelastic properties of solidifying alloys is proposed and
validated with experiments. The method consists of 2D image-based modeling and finite …
validated with experiments. The method consists of 2D image-based modeling and finite …
Microstructural evolution in Zr based Bulk Metallic Glass Matrix Composites (BMGMC) in Additive Manufacturing-Modeling and simulation
MMA Rafique - Available at SSRN 4361839, 2023 - papers.ssrn.com
Despite being well established phenomena, solidification principles are experiencing tough
challenges in their applications to explain microscale transport phenomena in additive …
challenges in their applications to explain microscale transport phenomena in additive …
Simulation of Real Image Microstructural Model of Semi-solid Aluminium Alloy Using a Coupled Eulerian–Lagrangian Approach
The main aim of this research is to simulate a compression test of semi-solid A380
aluminium alloy in numerical software. In order to achieve a more realistic model, 2D image …
aluminium alloy in numerical software. In order to achieve a more realistic model, 2D image …
Modeling and Simulation of Microstructural Rvolution in Zr based Metallic Glass Matrix Composites (MGMC) in Additive Manufacturing-Proposal
MMA Rafique, S Niezgoda - Available at SSRN 4363020, 2023 - papers.ssrn.com
Despite being well established phenomena, solidification principles are experiencing tough
challenges in their applications to explain microscale transport phenomena in additive …
challenges in their applications to explain microscale transport phenomena in additive …
Modelling and Simulation of Microstructural Evolution in Zr Based Bulk Metallic Glass Matrix Composites (Bmgmc) in Additive Manufacturing–a Proposal, Opinion and …
MMA Rafique - Opinion and Prospect, 2023 - papers.ssrn.com
Despite being well established phenomena, solidification principles are experiencing tough
challenges in their application to explain microscale transport phenomena in additive …
challenges in their application to explain microscale transport phenomena in additive …
Étude du comportement mécanique de l'alliage d'aluminium 5182 à faible fraction liquide
D Bernier - 2022 - corpus.ulaval.ca
Résumé Des simulations numériques thermomécaniques sont nécessaires afin de prédire
l'apparition des déchirures à chaud, survenant en fin de solidification, dans les procédés de …
l'apparition des déchirures à chaud, survenant en fin de solidification, dans les procédés de …
Viscosity properties prediction of semi-solid aluminum alloys using finite element analysis based on quenched solidified structure, and experimental validation
N Takatori, M Amano, R Miyachi, Y Nagata… - Materials …, 2020 - jstage.jst.go.jp
For predicting hot tearing during casting process, viscosity properties and constitutive
equations in the semi-solid region are required. In this research, viscosity properties of two …
equations in the semi-solid region are required. In this research, viscosity properties of two …
[PDF][PDF] Modelización de Microestructuras de Solidificación Dendrítica Mediante el Método de Elementos Finitos
Presentación de PowerPoint Page 1 RESULTADOS Y DISCUSIÓN Cada color representa una
dendrita METODOLOGÍA Una imagen se usó para representar las distribuciones de fases en …
dendrita METODOLOGÍA Una imagen se usó para representar las distribuciones de fases en …
[PDF][PDF] Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. Micromachines 2021, 12, 1331
Z Zhang, Z Wen, H Shi, Q Song, Z Xu, M Li, Y Hou… - 2021 - academia.edu
SiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high
failure rate during the dicing process. In this study, a novel dual laser beam asynchronous …
failure rate during the dicing process. In this study, a novel dual laser beam asynchronous …