A circuitized structure with a 3-dimensional configuration. A base structure is provided that
includes an insulating substrate of electrically insulating material with a flat configuration …

Packaged microelectronic elements are provided. In an exem plary embodiment, a
microelectronic element having a front face and a plurality of peripheral edges bounding the …

Tamper-respondent assemblies and methods of fabrication are provided which include an
inner enclosure, a tamper-respondent sensor (s), a protective wrap (s) and an outer …

One aspect of the invention provides an opto-electronic assembly referred to as a camera
module. The module accord ing to this aspect of the invention most preferably includes a …

The present invention is drawn toward miniaturized imaging devices. In one embodiment,
the device can include a utility guide having at least one aperture configured for supporting …

(57) ABSTRACT An integrated camera module (10, 10a) for capturing video images in very
Small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly …

257/E27. 001 (57) ABSTRACT Imager wafer level modules, methods of assembly for imager
wafer level modules, and systems containing imager wafer level modules. An imager die …

(57) ABSTRACT A miniaturized imaging device and method of viewing small luminal
cavities are described. The imaging device can be used as part of a catheter, and can …

Electronic packages are provided with enhanced heat dissipation capabilities. The
electronic package includes a plurality of electronic components, and an enclosure in which …

Tamper-proof electronic packages and fabrication methods are provided including an
enclosure enclosing, at least in part, at least one electronic component within a secure …