In this letter, we propose a method for optimizing the thermal placement of heat and non-
heat generating electronic components on a printed circuit board (PCB). Use a genetic …

This paper presents a fast and accurate steady state thermal simulator for heatsink and
microfluid-cooled 3D-ICs. This model considers the thermal effect of TSVs at fine-granularity …

With technology scaling towards smaller geometries, the power density of modern integrated
circuits (ICs) can potentially result into high temperatures during test, a problem further …

Power consumption and thereby the power minimization strategies in different steps of
design of nanoelectronic circuits is a raising concern today. Memristors with its inherent low …

Summary form only given. We post-process images compressed by lossy JPEG algorithms
(DCT and LOGO), following decompression, using Bezier polynomials for enhancement …

In DSM (deep sub-micron) regime, together with the integration density interconnects play a
dominant role during layout design of integrated circuits. It eventually increases the …

During recent days, the large problem space of very large scale integrated (VLSI) circuits
has led global routing problem to a NP Complete one. With the advent of three dimensional …

The high integration density interconnects, closerproximity of modules, and the routing
phase are pivotal during the layout of 3D ICs. Heuristic based approaches are typically used …

在此篇論文中, 熱感知擺放的問題被重新審視. 在先前的研究中, 主要著重於全域擺放(global
placement) 階段, 且效能通常是和擺置器(placer) 相關. 在此篇研究中溫度緩和的技術在後擺放 …

Since hotspots and temperature gradients are reliability and performance-critical issues in
processors, thermal awareness finds a vital place in the processor design cycle …