A new type of broadband link enabling extremely high-speed chip-to-chip communication is
presented. The link is composed of fully integrated sub-mmWave on-chip traveling wave …

Frequency and time domain models are developed for backplane (BP), printed circuit board
(PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for …

Circuit-level models are developed to determine the upper bound on the performance of a 3-
D IC link with through silicon vias (TSVs). It is shown that the performance of a 3-D link is …

In this study, we are pursuing an ultra low-loss interconnect pathway for 3D chip-chip
connectivity, incorporating air-clad planar interconnects, air-clad TSVs, and gradual vertical …

In this paper we present a compact model for analysis of 3D chip-to-chip interconnect
pathways consisting of planar transmission lines, vias, package and pin discontinuities. The …

Embodiments herein relate to a fully integrated broadband interconnect. The system
comprises a first integrated circuit, a second integrated circuit, and a coupler structure to …

Modern electronic systems are composed of a dense fabric of interconnected lines that
connect the electronic devices on a chip and chips on boards. The scaling of transistors to …

Graphene‐based heterostructures provide a viable platform to implement optoelectronic
devices that can operate in the terahertz (THz) band. In this study, the authors focus on …