Ultrafast quasi-three-dimensional imaging

Y Lian, L Jiang, J Sun, J Zhou… - International Journal of …, 2023 - iopscience.iop.org
Understanding laser induced ultrafast processes with complex three-dimensional (3D)
geometries and extreme property evolution offers a unique opportunity to explore novel …

Super-stealth dicing of transparent solids with nanometric precision

ZZ Li, H Fan, L Wang, X Zhang, XJ Zhao, YH Yu… - Nature …, 2024 - nature.com
Laser cutting of semiconductor wafers and transparent dielectrics has become a dominant
process in manufacturing industries, encompassing a wide range of applications from …

Femtosecond laser direct writing of functional stimulus-responsive structures and applications

Y Zhang, D Wu, Y Zhang, Y Bian, C Wang… - … Journal of Extreme …, 2023 - iopscience.iop.org
Diverse natural organisms possess stimulus-responsive structures to adapt to the
surrounding environment. Inspired by nature, researchers have developed various smart …

Super-resolution Laser Machining

J Huang, K Xu, S Xu - International Journal of Machine Tools and …, 2025 - Elsevier
Super-resolution laser machining represents a cutting-edge advancement in precision
manufacturing, striving to approach or even exceed the optical diffraction limit to produce …

Laser dicing of semiconductor wafers: Research status and current challenges

H Cao, Y Li, G Wang, Z Tang, D Sun, H Yin, Y Yu… - Optics and Lasers in …, 2025 - Elsevier
Laser dicing plays a vital role in the production of semiconductor devices. It significantly
affects both the quality and production costs of wafers. The inherent hardness and …

Ultrafast dynamics and ablation mechanism in femtosecond laser irradiated Au/Ti bilayer systems

Y Lian, L Jiang, J Sun, W Tao, Z Chen, G Lin, Z Ning… - …, 2023 - degruyter.com
The significance of ultrafast laser-induced energy and mass transfer at interfaces has been
growing in the field of nanoscience and technology. Nevertheless, the complexity arising …

Transmission laser welding of similar and dissimilar semiconductor materials

P Sopeña, A Wang, A Mouskeftaras… - Laser & Photonics …, 2022 - Wiley Online Library
Laser micro‐welding is an advanced manufacturing method today applied in various
domains. However, important physical limitations have prevented so far to demonstrate its …

Ultra-high-aspect-ratio structures through silicon using infrared laser pulses focused with axicon-lens doublets

N Ganguly, P Sopeña, D Grojo - Light: Advanced Manufacturing, 2024 - hal.science
We describe how a direct combination of an axicon and a lens can represent a simple and
efficient beam-shaping solution for laser material processing applications. We produce high …

[HTML][HTML] Multiphoton-initiated laser writing of semiconductors using nanosecond mid-infrared pulses

P Sopeña, N Ganguly, G Spühler, A Selivanau… - Optics & Laser …, 2024 - Elsevier
The advent of more powerful mid-infrared nanosecond laser sources allows using them as
attractive tools in material laser processing. For semiconductor bulk processing, laser …

Supercontinuum generation in bulk solid-state material with bursts of femtosecond laser pulses

B Momgaudis, V Marčiulionytė, V Jukna… - Scientific Reports, 2024 - nature.com
We report on experimental and numerical investigation of burst-mode supercontinuum
generation in sapphire crystal. The experiments were performed using bursts consisting of …