An expected lifetime of converters is of great importance for optimal decision-making in the
planning of modern Power Electronic (PE) systems. Hence, the lifetime management of …

Dielectric materials with high thermal conductivity (TC) can enable disruptive performance
enhancement in the areas of electronics packaging, thermal management, energy storage …

The quantity and variety of parameters involved in the failure evolutions in solder joints
under a thermo-mechanical process directs the reliability assessment of electronic devices …

Creep can have a significant impact on the reliability of Sn-based solder alloys even at room
temperature because of their relatively low melting temperatures. SnAgCu (SAC) solder …

When the dense pin-fins array distributed uniformly is used to dissipate the non-uniform heat
source, it is easy to generate excessive cooling at the non-hot spot, which leads to …

This article deals with the reliability of a power semiconductor exposing to the severe
thermal stresses. The importance of solder joint thickness on the power semiconductor's …

This research investigated the effects of rapid thermal shock cycle on the internal cracks,
microstructure and internal cracks of SAC305 ball by applying non-destructive high energy …

The present work aims at investigating how the BGA solder fatigue life in thermal cycling is
affected by prior isothermal aging. The Weibull distributions of SAC305 assemblies are …

A Cu-cored solder ball (CCSB) is often used as the interconnection material for 3D package.
The CCSB has a Cu core surrounded by Sn-Ag-Cu alloy. The effect of the Cu core on …

The assessment of solder joint quality and reliability in electronic devices has an important
role in many industries and guarantees challenges for reliability engineers. This article …