Non-invasive fault injection attacks have emerged as significant threats to a spectrum of
microelectronic systems ranging from commodity devices to high-end customized …

As Moore's law comes to a crawl, advanced package and integration techniques become
increasingly crucial by allowing for the combination of fabricated silicon dies, so-called …

Quantum computing has emerged as a promising paradigm, offering significant
advancements in solving complex problems that are intractable for classical computers …

The Internet-of-Thing (IoT) era inspires a surge of networked embedded devices in the real
world. However, cyber-attacks such as malware intrusions pose severe concerns about the …

The semiconductor industry has adopted heterogeneous integration (HI), incorporating
modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to …

Recent decades have witnessed a remarkable pace of innovation and performance
improvements in integrated circuits (ICs), which have become indispensable in an array of …

The ease and inexpensive setup of injecting timing faults in a hardware design make it
vulnerable to adversaries, resulting in confidentiality or integrity violations. The state-of-the …

Battery-operated applications have been ubiquitous all over the world ranging from power-
intensive electric cars down to low-power smart terminals and embedded devices …

Integrating heterogeneous components in multi-chiplet packaging, known as system-in-
package (SiP), is a significant step forward in overcoming limitations by Moore's Law and …

Hardware security for integrated circuits (ICs) is becoming an increasingly relevant issue for
semiconductor devices, and physical inspection methods are normally used as counter …