The continuous miniaturization of semiconductor requires the realization of 3D-IC. One
promising way to achieve 3D-IC is through full-intermetallic microbumps. To implement the …

The evaluation result of 4 layer stacked IC which was bonded using thermal compression
bonder (TCB) is reported. The throughput can be remarkably improved because chips of …

Adoption of Chip-to-Chip (C2C) and Chip-to-Wafer (C2W) thermocompression (TC) flip-chip
(FC) bonding in high volume manufacturing of advanced memory modules is accelerating …

Flip chip thermo-compression bonding (TCB) involves the use of heat and pressure to
simultaneously form interconnections for microelectronic packaging. In-situ measurements …

In plane collective bonding by NCF-TCB with the film inserted between the die and the
substrate, which had a significant potential to enhance the productivity, was studied. PTFE …

Thermocompression (TC) flip chip (FC) bonding enables packaging of the most advanced
semiconductor devices by allowing finer pitch and higher I/O interconnect while minimizing …

3D packaging technology has been considered as one of the best candidates to improve the
system performance by implementing high I/O density as well as providing shortest signal …

In this paper optimization process of D2W (Die to Wafer) TCB (Thermal Compression
Bonding) stacking for thinned, warped and large dies are investigated. TCB related …

This work explored interfaces that can be bonded through the use of In bump, flip-chip
techniques applied to structures for cryogenic packaging and interconnect technology. The …

A study was conducted to determine the feasibility of using a pre-applied underfill (PAUF)
and its associated Thermal Compression Bonding (TCB) process for challenging packaging …