Janus Green B (JGB) and Safranine T (ST) were used as levelers in the through-hole (TH)
copper electroplating experiments. Although JGB and ST have a similar part in the structure …

Electronic parameters of four additives for copper electroplating including accelerators,
mercaptopropane sulfonic acid (MPS) and bis-(acid-sulfopropyl)-disulfide (SPS), inhibitor …

A series of DPP derivatives bearing quaternary ammonium salt centers with different lengths
of carbon chains have been designed and synthesized. Their inhibition actions on copper …

A cyclic voltammetry (CV) screening method is proposed in this work to identify an effective
accelerator for the copper superfilling of microvias of a printed circuit board (PCB). Five …

We investigate the mechanism of 3-mercapto-1-propanesulfonate (MPS) acceleration of Cu
electrodeposition in the presence of Cl–through comparison with the inactive but related …

Numerical model was built based on a set of PDEs and the curvature-enhanced accelerator
coverage (CEAC) mechanism. Arbitrary Lagrange-Eulerian (ALE) method was used to track …

Except for the internal factors such as properties of additives, adsorption or desorption
mechanism, the external factors such as forced convection and environment temperature …

The roughness and mechanical properties of ultra‐low profile electrolytic copper foil
seriously affect and restrict its application in high‐frequency/high‐speed printed circuit …

Through-hole (TH) filling of an advanced printed circuit board (PCB) by copper
electroplating is performed using a direct current (DC) plating method and a simple copper …

Copper (Cu) electrodeposition from acidic solutions has been used extensively by the
microelectronic industry for interconnection in both Print Circuit Board (PCB) and integrated …