Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical
resistance properties due to their heterocyclic imide rings and aromatic rings on the …

Several high temperature polyimides, as model polymers with various chain rigidities and
chain orders, were synthesized through the polycondensation of p-phenylene diamine …

This technical note is an introductory overview of dielectric and magnetic measurement
metrology on packaging materials. Dielectric materials have many important functions in the …

A review is presented of the electrical characteristics of high-density, high-performance
interconnections used in digital and communication applications. These interconnections …

The heat transport properties of aromatic polyimide thin films have become more important
in the use for the electric insulation in the microelectronic devices with highly integrated …

A series of new polyimides was prepared by reacting 2, 6‐diaminopyridine with various
aromatic dianhydrides in DMF in 1: 1 mole ratio. All the resulting polyimides were readily …

Next generation microelectronic packaging requirements are driving the need to produce
increasingly lower dielectric constant materials while maintaining high thermal stability and …

Poly (p-phenylene pyromellitimide) and poly (4, 4'-biphenylene pyromellitimide) are
representatives of fully rod-like polyimides. Their structure and properties in thin films are …

Polyimide films with thicknesses ranging from 6 μm to 80 μm were prepared with a solvent
casting method to explore film thickness effects on the in-plane thermal expansion …

Three functional polyimides (PIs) bearing conjugated bis (triphenylamine)(2TPA) derivatives
with electron-donating and accepting groups were synthesized with reasonably high …