J Zhu, J Li, Y Tong, T Hu, Z Chen, Y Xiao… - Progress in Materials …, 2023 - Elsevier
Possessing a unique combination of properties that are traditionally contradictory in other natural or synthetical materials, Ga-based liquid metals (LMs) exhibit low mechanical …
G Yang, L Zhou, X Zhang, D Pan, M Wang… - Composites …, 2023 - Elsevier
Polymer composites with excellent thermally conductive, electrically insulating, and thermal resistance proprieties are urgently needed due to the rapid development of modern high …
F Luo, W Cui, Y Zou, H Li, Q Qian - Journal of Materials Chemistry A, 2023 - pubs.rsc.org
The increasing demand of thermal management materials consumes a large amount of petrochemical and inorganic mineral resources. It is essential to develop a kind of highly …
G Yang, L Zhou, M Wang, T Xiang, D Pan, J Zhu, F Su… - Nano Research, 2023 - Springer
The rapid improvement in the running speed, transmission efficiency, and power density of miniaturized devices means that multifunctional flexible composites with excellent thermal …
Y Zhao, Z Zhang, Z Ling, X Gao, X Fang - Applied Thermal Engineering, 2022 - Elsevier
Thermal interface materials that possess high thermal conductivity and can reach low thermal impedance during service, are highly desirable for chip heat dissipation systems …
W Zhou, W Wang, H Shi, X Zeng, J Li… - Advanced Materials …, 2023 - Wiley Online Library
The ever‐increasing computing power in modern electronics comes with significant heat waste that can't be ignored. For microchips to dissipate heat efficiently, thermal interface …
X Zhang, ZS Deng - Science China Technological Sciences, 2023 - Springer
As electronic devices continue to evolve toward miniaturization and integration, traditional thermal interface materials (TIMs) are no longer able to meet the ever-tougher thermal …
J Tan, G Zhu, F Yang, S Zhang, Q Wu, L Xu, Y Li… - Composites Part A …, 2023 - Elsevier
As soft electronic devices and robotics advance towards high power density and miniaturization, integrating superior thermal and mechanical properties has become a big …
X Hu, Z Tian, C Chen, G Jiang, L Wang, R Peng… - International Journal of …, 2023 - Elsevier
Thermal management systems are facing significant demand to dissipate increasing heat fluxes in time, however, heat transfer between solid surfaces is always obstructed due to the …