Superwetting surfaces for diminishing leidenfrost effect, methods of making and devices incorporating the same

KK Varanasi, JD Smith, AT Paxson, CJ Love… - US Patent …, 2015 - Google Patents
Textured surface for increasing Leidenfrost temperature. The texture comprises of surface
features over multiple length scales—from micro to nanoscale—wherein the features at each …

Heat exchange assembly for use with electrical devices and methods of assembling an electrical device

SE Weaver Jr, T Deng, HPJ De Bock… - US Patent …, 2014 - Google Patents
An electrical device is described herein. The electrical device includes a housing that
includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and …

Sheet-shaped heat pipe

T Wakaoka, A Kishimoto, T Miura - US Patent 10,544,994, 2020 - Google Patents
(57) ABSTRACT A sheet-shaped heat pipe includes a sheet-shaped container, a wick
sealed in the container, and a working fluid sealed in the container, the sheet-shaped …

Heat exchange assembly and methods of assembling same

SS Chauhan, SE Weaver Jr, T Deng… - US Patent …, 2014 - Google Patents
(57) ABSTRACT A heat exchange assembly for use in cooling an electrical component is
described herein. The heat assembly includes a casing that includes an evaporator section …

Micropillar-enabled thermal ground plane

RJ Lewis, LA Liew, CY Lin, CJ Coolidge, S Xu… - US Patent …, 2020 - Google Patents
A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate
member configured to enclose a working fluid; a second planar substrate member …

Enhanced flow boiling heat transfer in microchannels with structured surfaces

E Wang, ZHU Yangying, KH Chu, DS Antao - US Patent 10,867,887, 2020 - Google Patents
(57) ABSTRACT A two-phase microchannel heat sink can be a fluid channel including a
bottom wall including a superhydrophilic sur face with microstructures and a side wall …

Thermal ground plane

R Yang, YC Lee, VM Bright, C Li, C Oshman… - US Patent …, 2020 - Google Patents
Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A
flexible thermal ground plane may include a support member. The flexible thermal ground …

Thermal ground plane

R Yang, YC Lee, VM Bright, C Li, C Oshman… - US Patent …, 2020 - Google Patents
Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A
flexible thermal ground plane may include a support member. The flexible thermal ground …

Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems

RJ Lewis, R Yang, YC Lee - US Patent 12,104,856, 2024 - Google Patents
Some embodiments of the invention include a thermal ground plane with a variable
thickness vapor core. For example, a thermal ground plan may include a first casing and a …

Non-metallic vapor chambers

M MacDonald - US Patent 10,302,367, 2019 - Google Patents
A non-metallic vapor chamber includes a composite wick structure that fills a non-metallic
housing. The composite wick structure provides mechanical strength and structural rigidity to …